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富藤科技產品信息

產品名稱:IGBT Ultrasonic Metal Bonding Machine

產品類別:Ultrasonic Bonding Machine

IGBT Ultrasonic Metal Bonding Machine(Ultrasonic metal bonder)

IGBT Ultrasonic Metal Bonding Machine(Ultrasonic metal bonder)


IGBT超聲波金屬鍵合機(超聲波金屬鍵合機))

Ultrasonic bonding system which is appropriate for producing power device

適用于功率模塊生產的超聲波鍵合系統

  • Flexible manufacturing
  • 柔性制造
  • Resistant to terminal floating
  • 抗終端浮動
  • Color image processing
  • 彩色圖像處理

Homogeneous/Heterogeneous Metal Bonding

Homogeneous/Heterogeneous Metal Bonding

同類/異類金屬鍵合

It bonds heterogeneous metals well, which was hard to achieve with conventional bonding method. Needless to solder, you can bond them directly at room temperature

它可在室溫下直接鍵合異質金屬,這是傳統焊接方法難以實現的。

IGBT Module (Terminal bonding)

IGBT Module (Terminal bonding)

IGBT模塊(終端連接)

It is desirable to bond without soldering when dealing with IGBT module, which requires high temperature during operation. Ultrasonic bonds the lead on the package side and the electrode on the DBC substrate directly

在處理IGBT模塊時,無需傳統的高溫焊接。超聲波將封裝側導線和DBC基板上電極直接鍵合

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